Performance Characteristics
It is suitable for copper layer thinning before precision circuit fabrication and laser direct drilling
It has good leveling effect, and the thickness of copper layer is uniform after thinning
Etch rate (3.5-6.0um/min) is stable and controllable
Good solubility, no liquid residue after washing, and does not affect the subsequent process
The same series of liquid medicine can provide two kinds of liquid medicine with different dilution times according to customer needs
Treatment Effect
Treatment Morphology
Surface morphology of copper before treatment, 500X magnification
After 4um thinning, the surface morphology of copper was enlarged by 500X
After 8um thinning, the surface morphology of copper was enlarged by 500X
Thinning Uniformity
Before treatment, the thickness of copper was 0.7um
After 4um thinning, the thickness difference is 0.8um, which is basically similar to before thinning
After 8um thinning, the thickness range is 1.3um, and the range only increases by 0.6um
SCAN