Performance characteristics
It is suitable for fine circuit fabrication in semi-additive process
Etch rate of copper (3-5um / min) is stable and controllable
The downward etching rate is twice the lateral etching rate to reduce undercut and ensure the best flash etching effect
Etching 12um can still ensure that the line remains in good shape
Treatment effect
Treatment Morphology
The surface morphology of copper before treatment
The surface morphology of copper after 8um treatment
Line profile
In mSAP process 50 μm line profile before and after line flash etching. Side micro etching, single side about 7.8 μm. Downward micro etching thickness 12.3 μm. The downward rate is about 1.6 times that of side micro etching.
SCAN